FEATURES
Lead-free compatible Halogen free material
BT resin based material
Lower X,Y/Z-axis CTE
High glass transition temperature, High heat resistance
Keeping high modulus in high temperature
White LED with high reflectance of visible light
Less discoloration after heat treatment and light irradiation
Good punching & Drilling ability
APPLICATIONS
Chip LED Substrates
IC Package
MINI LED
COB
GENERAL PROPERTIES
Item | Test method | Unit | HW20-M2 |
UL No. | - | - | E136069 |
Min Thickness | UL | mm | 0.05 |
Tg | DMA | ℃ | ≥190 |
Td（5%loss） | 10℃/min@N_2 | ℃ | 380 |
T260 | TMA | min | ＞60 |
T288 | TMA | min | |
Thermal Stress | 288℃, Solder dip | - | 6 cycles pass |
Z-axis CTE | Before Tg | PPM/℃ | 30 |
After Tg | PPM/℃ | 180 | |
50-260℃ | % | 1.8 | |
X/Y-axis CTE | Before Tg | PPM/℃ | 11-13 |
After Tg | PPM/℃ | 5-10 | |
Thermal conductivity | A | W/（m·k） | 0.7 |
Moisture Absorption | D-24/23 | % | ＜0.1 |
Dk | 10GHz | - | 5.2 |
Df | 10GHz | - | 0.02 |
Dielectric Breakdown | D-48/50+D-0.5/23 | KV | 45KV/mm |
Reflectance(@457nm) | A | % | 90% |
180℃4H after baking | 80% | ||
UV(@385nm*1000H) | |||
Dielectric constant | 1 GHz, C-24/233/50 | - | 5.8 |
Peel Strength (LW/CW) | A | N/mm | ≥0.80 N/mm(@T oz) |
288℃/10S | ≥0.80N/mm(@T oz) | ||
Bending strength (LW/CW) | A | Mpa | 480/480 |
Volume Resistivity | After moisture | MΩ-cm | ≥ |
E-24/125 | ≥ | ||
Surface resistivity | After moisture | MΩ | ≥ |
E-24/125 | ≥ | ||
Young’s modulus | LW | Gpa | 23 |
CW | Gpa |
Line up of laminate |
Thickness(mm) | Thickness Tolerance(mm) | Glass fabrics ply | Cooper Foil | Standard Size |
0.050 | 0.050±0.005 | 2*1027 |
12μm 18μm 35μm 70μm | 37” *49” 41” *49” 43” *49”
|
0.065 | 0.065±0.005 | 2*1037 | ||
0.100 | 0.100±0.010 | 2*1078 | ||
0.150 | 0.150±0.010 | 2*1078 | ||
0.200 | 0.200±0.010 | 2*2116 | ||
0.300 | 0.300±0.010 | 3*2116 | ||
0.400 | 0.400±0.010 | 4*2116 | ||
0.500 | 0.500±0.015 | 3*2116 | ||
0.600 | 0.600±0.020 | 4*2116 | ||
1.000 | 1.000±0.030 | 6*2116 | ||
1.500 | 1.500±0.030 | 8*7628 |
Glass fabric | Resin Content | Presumed Thickness (Inner copper remaining ratio is 100%) |
#1037 | 72% | 0.04mm |
78% | 0.05mm | |
#1067 | 72% | 0.05mm |
77% | 0.06mm | |
#1078 | 64% | 0.06mm |